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參數(shù)資料
| 型號： | 32-1/G4C-AQSB |
| 廠商： | Everlight Electronics Co Ltd |
| 文件頁數(shù)： | 6/9頁 |
| 文件大小： | 344K |
| 描述： | LED PWR FLAT INGAN GREEN CLEAR |
| 標(biāo)準(zhǔn)包裝： | 60 |
| 顏色： | 綠 |
| 正向電壓： | 3.3V |
| 電流 - 測試： | 30mA |
| 波長 - 主： | 525nm |
| 波長 - 峰值： | 518nm |
| 視角： | 130° |
| 透鏡類型： | 透明 |
| 透鏡樣式/尺寸： | 方形，帶平頂，7.62mm |
| 封裝/外殼： | 徑向 |
| 尺寸/尺寸： | 7.62mm L x 7.62mm W |
| 高度： | 2.50mm |
| 安裝類型： | 通孔 |
| 包裝： | 管件 |
| 在特定電流下的光通量 - 測試： | 4.5 lm |
Technical Data Sheet
Flat POWER LED
32-01/G4C-AQSB
Everlight Electronics Co., Ltd. http:\\www.everlight.com Rev.2 Page: 6 of 9
Device number: DPE-0000020 Established date: 06-05-2009 Established by: Jim Lin
Notes
1. Lead Forming
During lead formation, the leads should be bent at a point at least 3mm from the base of the
epoxy bulb.
Lead forming should be done before soldering.
Avoid stressing the LED package during leads forming. The stress to the base may damage
the LEDs characteristics or it may break the LEDs.
Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures
may cause failure of the LEDs.
When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead
position of the LED. If the LEDs are mounted with stress at the leads, it causes
deterioration of the epoxy resin and this will degrade the LEDs.
2. Storage
The LEDs should be stored at 30癈 or less and 70%RH or less after being shipped from
Everlight and the storage life limits are 3 months. If the LEDs are stored for 3 months or
more, they can be stored for a year in a sealed container with a nitrogen atmosphere and
moisture absorbent material.
Please avoid rapid transitions in ambient temperature, especially, in high humidity
environments where condensation can occur.
3. Soldering
Careful attention should be paid during soldering. Solder the LED no lower than 1.6mm
from the base of stopper is recommended.
Avoiding applying any stress to the lead frame while the LEDs are at high temperature
particularly when soldering.
Recommended soldering conditions:
Hand Soldering
DIP Soldering
Temp. at tip of iron
300
Max. (30W Max.)
Preheat temp.
100
Max. (60 sec Max.)
Soldering time
3 sec Max.
Bath temp.
260 Max.
Distance
No lower than 1.6mm from
the base of stopper
Bath time.
5 sec Max.
Distance
No lower than 1.6mm from
the base of stopper
Avoiding applying any stress to the lead frame while the LEDs are at high temperature
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