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參數資料
| 型號： | MC54HC4053 |
| 廠商： | Motorola, Inc. |
| 英文描述： | ANALOG MULTIPLEXERS DEMULTIPLEXERS |
| 中文描述： | 模擬多路復用器復用器 |
| 文件頁數： | 13/15頁 |
| 文件大小： | 451K |
| 代理商： | MC54HC4053 |
MC54/74HC4051 MC74HC4052 MC54/74HC4053
High–Speed CMOS Logic Data
DL129 — Rev 6
13
MOTOROLA
OUTLINE DIMENSIONS
J SUFFIX
CERAMIC PACKAGE
CASE 620–10
ISSUE V
N SUFFIX
PLASTIC PACKAGE
CASE 648–08
ISSUE R
19.05
6.10
—
0.39
1.27 BSC
1.40
2.54 BSC
0.21
3.18
7.62 BSC
19.93
7.49
5.08
0.50
1.65
0.38
4.31
0
°
0.51
15
°
1.01
MIN
0.750
0.240
—
0.015
0.050 BSC
MIN
MAX
0.785
0.295
0.200
0.020
MAX
INCHES
MILLIMETERS
DIM
A
B
C
D
E
F
G
J
K
L
M
N
0.055
0.100 BSC
0.008
0.125
0.300 BSC
0
°
0.020
0.065
0.015
0.170
15
°
0.040
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIM F MAY NARROW TO 0.76 (0.030) WHERE
THE LEAD ENTERS THE CERAMIC BODY.
1
8
9
16
–A
–
–B
–
C
K
N
G
E
F
D
16 PL
–T
PLANE
SEATING
M
L
J
16 PL
0.25 (0.010)
T
A
M
S
0.25 (0.010)
T
B
M
S
MIN
0.740
0.250
0.145
0.015
0.040
MIN
18.80
6.35
3.69
0.39
1.02
MAX
0.770
0.270
0.175
0.021
0.070
MAX
19.55
6.85
4.44
0.53
1.77
INCHES
MILLIMETERS
DIM
A
B
C
D
F
G
H
J
K
L
M
S
0.21
2.80
7.50
0
°
0.51
0.38
3.30
7.74
10
°
1.01
0.008
0.110
0.295
0
°
0.020
0.015
0.130
0.305
10
°
0.040
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
2.54 BSC
1.27 BSC
0.100 BSC
0.050 BSC
–A
–
B
1
8
9
16
F
H
G
D
16 PL
0.25 (0.010)
M
S
C
–T
–
SEATING
PLANE
K
J
M
L
T
A
M
0.25 (0.010)
T
B
A
M
S
S
MIN
9.80
3.80
1.35
0.35
0.40
MIN
0.386
0.150
0.054
0.014
0.016
0.050 BSC
MAX
10.00
4.00
1.75
0.49
1.25
MAX
0.393
0.157
0.068
0.019
0.049
MILLIMETERS
INCHES
DIM
A
B
C
D
F
G
J
K
M
P
R
0.19
0.10
0
°
5.80
0.25
0.25
0.25
7
°
6.20
0.50
0.008
0.004
0
°
0.229
0.010
0.009
0.009
7
°
0.244
0.019
1.27 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
1
8
9
16
–A
–
–B
–
D
16 PL
K
C
G
–T
PLANE
SEATING
R
X 45
°
M
J
F
P
8 PL
0.25 (0.010)
B
M
M
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
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